Renesas Electronics Corp. has launched its SmartBond DA1470x family of Bluetooth low energy (LE) solutions. Claimed as the most advanced integrated wireless system-ON-chip (SoC) family, the DA1470x is touted as the only solution in the Bluetooth LE space to integrate a power management unit (PMU), a hardware voice activity detector (VAD), a graphics processing unit (GPU) and Bluetooth LE connectivity in a single chip.
Click for a larger image. (Source: Renesas Electronics)
Providing advanced sensor and graphical capabilities and ultra-low-power, always-on audio processing, the wireless SoCs are suited for wearables like smartwatches and fitness trackers; glucose monitor readers and other consumer medical and health-care devices; home appliances with displays, industrial automation and security systems, and Bluetooth consoles such as e-bikes and gaming equipment.
Thanks to the integration of more functions, the devices also deliver a cost savings on the bill of materials, resulting in smaller form factor designs and/or freeing up space for additional components or larger batteries.
Block diagram of SmartBond DA1470x Bluetooth LE wireless SoC. (Source: Renesas Electronics)
The DA1470x wireless SoCs are built on a multi-core system, an Arm Cortex-M33 processor as the main application core and Cortex-M0+ as the sensor node controller. It includes an integrated 2D GPU & display controller supporting DPI, JDI parallel, DBI, and single/dual/quad SPI interfaces. Other features include a configurable MAC supporting Bluetooth LE 5.2 and proprietary 2.4-GHz protocols, an integrated 720-mA JEITA-compliant USB charger that supports rechargeable Li-ion/Li-Po batteries, an integrated low-quiescent-current SIMO DC/DC converter of the PMU, and ultra-low-power hardware VAD for always-on audio processing.
The family is comprised of four devices – the DA14701, DA14705, DA14706, and DA14708. Check out the product brief for a selector guide.
Renesas has developed two new Winning Combinations – a Wearable Activity Tracker and an Instrument Panel for Light EVs and eBikes – that combine the DA1470x with multiple components from its product portfolio. The company will demo the DA1470x family at Embedded World, June 21-23, in Hall 1, booth #1-234.
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