#RC28F640J3D75 Intel RC28F640J3D75 New Flash, 4MX16, 75ns, PBGA64, ESBGA-64, RC28F640J3D75 pictures, RC28F640J3D75 price, #RC28F640J3D75 supplier

Manufacturer Part Number: RC28F640J3D-75
Rohs Code: No
Part Life Cycle Code: Transferred
Ihs Manufacturer: INTEL CORP
Part Package Code: BGA
Package Description: TBGA, BGA64,8X8,40
Pin Count: 64
ECCN Code: 3A991.B.1.A
HTS Code: 8542.32.00.51
Manufacturer: Intel Corporation
Risk Rank: 5.63
Access Time-Max: 75 ns
Alternate Memory Width: 8
Command User Interface: YES
Common Flash Interface: YES
Data Polling: NO
JESD-30 Code: R-PBGA-B64
JESD-609 Code: e0
Length: 13 mm
Memory Density: 67108864 bit
Memory IC Type: FLASH
Memory Width: 16
Number of Functions: 1
Number of Sectors/Size: 64
Number of Terminals: 64
Number of Words: 4194304 words
Number of Words Code: 4000000
Operating Mode: ASYNC-LATCHED
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -40 °C
Organization: 4MX16
Package Body Material: PLASTIC/EPOXY
Package Code: TBGA
Package Equivalence Code: BGA64,8X8,40
Package Shape: RECTANGULAR
Page Size: 4/8 words
Parallel/Serial: PARALLEL
Peak Reflow Temperature (Cel): 240
Power Supplies: 3/3.3 V
Programming Voltage: 2.7 V
Qualification Status: Not Qualified
Ready/Busy: YES
Seated Height-Max: 1.2 mm
Sector Size: 128K
Standby Current-Max: 0.00012 A
Subcategory: Flash Memories
Supply Current-Max: 0.08 mA
Supply Voltage-Max (Vsup): 3.6 V
Supply Voltage-Min (Vsup): 2.7 V
Supply Voltage-Nom (Vsup): 3 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: INDUSTRIAL
Terminal Finish: TIN LEAD
Terminal Form: BALL
Terminal Pitch: 1 mm
Terminal Position: BOTTOM
Flash, 4MX16, 75ns, PBGA64, ESBGA-64