NXP Semiconductors has introduced its BTS7202 RX front-end modules (FEMs) and BTS6403/6305 pre-drivers that help improve 5G call quality and network coverage thanks to higher output power, improved linearity, and reduced noise. The higher power BTS7202 RX FEMs and BTS6403/6305 pre-drivers for 5G massive multiple-input multiple-output (MIMO), built ON NXP’s silicon germanium (SiGe) process, also offer “modest” current consumption to reduce operational costs for mobile network operators (MNOs), said NXP.
(Source: NXP Semiconductors)
The BTS7202 RX FEMs and BTS6403/6305 pre-drivers offer a solution for 5G base stations, complementing NXP’s power Amplifier solutions for 32T32R radios. “MNOs are increasingly leveraging 32T32R solutions to improve massive MIMO coverage in less dense urban and suburban areas,” said NXP. “Utilizing 32T32R solutions requires using higher power devices that increase the power level per channel in order to achieve the total power required to ensure strong coverage of the 5G signal.”
NXP recently launched a new family of RF power transistors for 32T32R active antenna systems, using its latest proprietary gallium nitride (GaN) technology. The new 32T32R discrete solutions are said to deliver twice the power in the same package as 64T64R solutions, resulting in smaller and lighter weight 5G radios.
Designed for 5G mMIMO infrastructure applications, the dual-receiver BTS7202 RX FEMs feature two independent receive channels each with a low noise amplifier and a switch capable of handling up to 20 W. Other key specs include an operating frequency range of 3.3-4.2 GHz, 500 mW power dissipation per channel, a typical noise figure of 0.95 dBm (10.5 dB PAPR), and matching to 50 Ω. The BTS7202U is housed in a HVQFN40 package, measuring 6 × 6 × 0.85 mm.
The BTS6403/6305 pre-drivers offer fast on-off switching to support TDD systems. Key specs include a frequency range of 2.4-4.2 GHz, 5-V single supply, and quiescent current of 68 mA (BTS6403) and 80 mA (BTS6305). The BTS6305 also integrates a balun to reduce costs, said NXP. The pre-drivers are housed in a 3 × 3 × 0.85 mm 16-terminal HVQFN package.
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