Surface-mount technology (SMT) is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner…Continue readingSMD
A quad flat package (QFP) is a surface-mounted integrated circuit package with “gull wing” leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting…Continue readingQFP
Flat no-leads package, Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as…Continue readingQFN
Field-programmable gate array, A field-programmable gate array (FPGA) is an integrated circuit designed to be configured by a customer or a designer after manufacturing – hence the term “field-programmable”. The…Continue readingFPBGA
Dual in-line package, with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in…Continue readingDIP Package
SOIC: A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a…Continue readingSOIC
