#EP1K30FC256-3N ALTERA EP1K30FC256-3N New Loadable PLD, 0.6ns, CMOS, PBGA256, FINE LINE, BGA-256, EP1K30FC256-3N pictures, EP1K30FC256-3N price, #EP1K30FC256-3N supplier

Manufacturer Part Number: EP1K30FC256-3N
Rohs Code: Yes
Part Life Cycle Code: Obsolete
Ihs Manufacturer: Intel CORP
Package Description: BGA, BGA256,16X16,40
HTS Code: 8542.39.00.01
Manufacturer: Intel Corporation
Risk Rank: 5.24
JESD-30 Code: S-PBGA-B256
JESD-609 Code: e1
Length: 17 mm
Moisture Sensitivity Level: 3
Number of I/O Lines: 171
Number of Inputs: 171
Number of Logic Cells: 1728
Number of Outputs: 171
Number of Terminals: 256
Operating Temperature-Max: 70 °C
Organization: 171 I/O
Output Function: MIXED
Package Body Material: PLASTIC/EPOXY
Package Code: BGA
Package Equivalence Code: BGA256,16X16,40
Package Shape: SQUARE
Package Style: GRID ARRAY
Peak Reflow Temperature (Cel): 260
Power Supplies: 2.5,2.5/3.3 V
Programmable Logic Type: LOADABLE PLD
Propagation Delay: 0.6 ns
Qualification Status: Not Qualified
Seated Height-Max: 2.1 mm
Subcategory: Field Programmable Gate Arrays
Supply Voltage-Max: 2.625 V
Supply Voltage-Min: 2.375 V
Supply Voltage-Nom: 2.5 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: COMMERCIAL
Terminal Finish: TIN SILVER COPPER
Terminal Form: BALL
Terminal Pitch: 1 mm
Terminal Position: BOTTOM
Loadable PLD, 0.6ns, CMOS, PBGA256, FINE LINE, BGA-256